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QFN Rework: Thermal Pad Heat Transfer Challenges

Updated 18 May 2026

Contents & prerequisites

Prerequisites

BGA Replacement Alignment: X-Ray Verification Post-Reflow

Unlocks

LGA Component Rework: Pad Damage Prevention

Article in preparation

QFN Rework: Thermal Pad Heat Transfer Challenges

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Learning

PreviousProfile Measurement Equipment: KIC, ECD, Datapaq NextQFP / TQFP Soldering Technique: Drag Soldering Method

Evidence

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