Soldering
PCB assembly, solder materials, reflow/wave soldering, rework/hand soldering, quality inspection, and IPC standards.
210 topics · 9 with articles
Intern Engineer· 1 of 30
- Bare Board Incoming Inspection per IPC-A-600Read
- Component Lead Finish Compatibility: Sn, NiPdAu, HASLArticle coming
- Component Placement Density and Thermal ManagementArticle coming
- Component Placement Tolerances per IPC-7711Article coming
- Component Polarity Marking and Orientation StandardsArticle coming
- Component Polarity Verification and Error-ProofingArticle coming
- Conformal Coating Basics: Types and Application MethodsArticle coming
- Depanelling Methods: Router, V-Scoring, LaserArticle coming
- Double-Sided PCB Assembly Sequence StrategyArticle coming
- ESD-Sensitive Component Handling (ANSI/ESD S20.20)Article coming
- Fiducial Mark Design and Vision Camera ReferenceArticle coming
- First Article Inspection (FAI) for SMT AssemblyArticle coming
- IC Package Types: SOIC, QFP, BGA, LGA, QFN, DFNArticle coming
- MSD (Moisture Sensitive Device) Bake and Open ProcedureArticle coming
- PCB Cleaning: No-Clean vs. Water-Soluble Flux StrategyArticle coming
- PCB Impedance Control and Test Coupon DocumentationArticle coming
- PCB Layer Stack-Up: Signal, Power, GND LayersArticle coming
- PCB Storage: Moisture Control and MSD Level ManagementArticle coming
- Panel Design: V-Groove, Tab-Routed, BreakawayArticle coming
- Pick & Place Machine Operation and Feeder TypesArticle coming
- SMD Package Types: 0402, 0603, 0805, 1206, 2512Article coming
- SMT (Surface Mount Technology) Basic ConceptsArticle coming
- SMT Line Flow Diagram: Printer → P&P → Oven → AOIArticle coming
- SMT Line OEE (Overall Equipment Effectiveness) TrackingArticle coming
- Silkscreen (Legend) Placement GuidelinesArticle coming
- Solder Mask: LPI Coating and Opening RulesArticle coming
- Solder Paste Printing: Squeegee Pressure, Speed, AngleArticle coming
- Stencil Design: Aperture Geometry and Reduction RatioArticle coming
- Stencil Thickness Selection: 100µm, 120µm, 150µmArticle coming
- THT (Through-Hole Technology) Component TypesArticle coming
Junior Engineer· 0 of 30
- Alloy Selection Criteria for Reliability and ApplicationArticle coming
- Anisotropic Conductive Film (ACF) as Solder AlternativeArticle coming
- Bismuth-Containing Alloys and Low Melting Point Trade-offsArticle coming
- Bismuth-Containing Low-Temperature Solder AlloysArticle coming
- Cu3Sn and Cu6Sn5 IMC Layer Growth KineticsArticle coming
- Electromigration in Solder Joints under High Current DensityArticle coming
- Flux Activation Temperature and Activator ChemistryArticle coming
- Flux Residue Analysis and Corrosion Risk AssessmentArticle coming
- Flux Types: Rosin (R, RMA, RA), No-Clean, Water-SolubleArticle coming
- Gold Embrittlement: Au Content Limit in Solder JointArticle coming
- Indium-Based Alloys (InSn, InPb) for Cryogenic ApplicationsArticle coming
- Ni/Au Surface Finish IMC Formation MechanismArticle coming
- RoHS Directive and Lead-Free Transition HistoryArticle coming
- SAC305 (Sn96.5 Ag3.0 Cu0.5): Industry Standard AlloyArticle coming
- SAC405 (Sn95.5 Ag4.0 Cu0.5): Higher Silver ContentArticle coming
- SN100C (Sn99.3 Cu0.7 Ni): Low-Cost Lead-Free OptionArticle coming
- Silver Sintering for Power Module Die AttachArticle coming
- Solder Alloy Fundamentals: Eutectic Point and Phase DiagramArticle coming
- Solder Bar: Wave Solder Pot Alloy CompositionArticle coming
- Solder Bath Analysis: ICP-MS and X-Ray FluorescenceArticle coming
- Solder Joint Metallurgy: IMC (Intermetallic Compound) FormationArticle coming
- Solder Paste Post-Print SPI (2D/3D) Volume AnalysisArticle coming
- Solder Paste Post-Refrigeration Warm-Up ProcedureArticle coming
- Solder Paste Stirring and Conditioning ProtocolArticle coming
- Solder Paste Storage: Refrigeration (+2/+8°C) and Shelf LifeArticle coming
- Solder Paste Types: Type 3 (25-45µm), Type 4, Type 5Article coming
- Solder Paste Viscosity, Slump Test, and Tack TimeArticle coming
- Solder Pot Contamination: Cu, Ag, Bi Buildup AnalysisArticle coming
- Solder Wire: Core Flux Types (Rosin, No-Clean) and DiameterArticle coming
- Tin-Lead Solder (SnPb 63/37): Properties and ApplicationsArticle coming
Middle Engineer· 3 of 60
- BGA Pad Cleaning: Wick, Flux Application, and HeatArticle coming
- BGA Reballing: Ball Placement Using Stencil MethodArticle coming
- BGA Reflow: Collapse Control and Standoff HeightArticle coming
- BGA Removal: Thermal Profile and Controlled Lift MechanismArticle coming
- BGA Replacement Alignment: X-Ray Verification Post-ReflowArticle coming
- BGA Rework: Profile Programming and Optical AlignmentArticle coming
- CSP (Chip Scale Package) Rework TechniquesArticle coming
- Component Delta-T: Cold and Hot Spot AnalysisArticle coming
- Conveyor Angle and Speed OptimizationArticle coming
- Cooling Rate: Max 4°C/sec Rule and Microstructure ImpactArticle coming
- Desoldering Pump: Manual and Electric (Vacuum) TypesArticle coming
- Double-Pass Reflow (Double-Sided): Bottom-Side TemperatureArticle coming
- ESD-Safe Workstation Setup per IPC-A-610Article coming
- Flux Application for Rework: Pen, Brush, AerosolArticle coming
- Hand Soldering Basic Technique: Iron Angle and Heat ControlArticle coming
- Heat Transfer Efficiency: Iron-Pad-Component ContactArticle coming
- Heat-Sensitive Component Protection: Heat Sink ClipsArticle coming
- Hot Air Station: Nozzle Selection, Temperature and AirflowArticle coming
- IPC-7711/7721: Rework, Modification, and Repair StandardRead
- LGA Component Rework: Pad Damage PreventionArticle coming
- Nitrogen (N2) Atmosphere Reflow: Benefits and CostArticle coming
- Oven Calibration Period and Thermocouple VerificationArticle coming
- PCB Pad Repair: Bridge Adhesive and Jumper WireArticle coming
- PCB Trace Repair: Conductive Epoxy and Copper FoilArticle coming
- Post-Rework Cleaning: Isopropyl Alcohol (IPA) 99%Read
- Preheat Zone: Flux Activation and Moisture RemovalArticle coming
- Profile Measurement Equipment: KIC, ECD, DatapaqArticle coming
- QFN Rework: Thermal Pad Heat Transfer ChallengesArticle coming
- QFP / TQFP Soldering Technique: Drag Soldering MethodArticle coming
- Reflow Oven Conveyor Width and PCB HandlingArticle coming
- Reflow Oven Zones: Preheat, Soak, Reflow, CoolingArticle coming
- Reflow Peak Temperature: SAC305 Target 235-250°CArticle coming
- Reflow Profile Optimization Using DOE MethodologyArticle coming
- Reflow Profile: Ramp Rate Limits (°C/sec) per J-STD-020Read
- Rework Quality Verification: Visual and X-Ray InspectionArticle coming
- Rework Station Calibration and Traceability Record KeepingArticle coming
- SMD Component Removal with Hot Air StationArticle coming
- SOIC and SOP Component Hand Soldering SequenceArticle coming
- Selective Soldering THT Component ProgrammingArticle coming
- Selective Soldering: Nozzle Types and Flux Spot ApplicationArticle coming
- Soak Zone: Thermal Equalization Across BoardArticle coming
- Solder Beading Defect: Stencil and Paste Design RelationArticle coming
- Solder Paste Slump Test (IPC-TM-650 2.4.35)Article coming
- Solder Wick (Braid) Usage and SelectionArticle coming
- Solder Wire Application Technique: Heat Pad, Then Apply WireArticle coming
- Soldering Iron Selection: Wattage and Tip TypeArticle coming
- Surface Finish Compatibility: ENIG, OSP, HASL with ReflowArticle coming
- THT Component Soldering: Solder Fill per IPC-A-610 CriteriaArticle coming
- Thermocouple Profile Measurement: TC Attachment on BoardArticle coming
- Time Above Liquidus (TAL): Typical 45-75 secArticle coming
- Tip Cleaning: Wet Sponge vs. Brass Wire WoolArticle coming
- Tombstoning Defect: Root Cause and PreventionArticle coming
- Vacuum Reflow Oven for Void ReductionArticle coming
- Via Repair: Conductive Epoxy Fill and CappingArticle coming
- Voiding in Solder Joints: Causes and IPC Acceptance LimitsArticle coming
- Wave Flux Application Methods: Foam, Spray, JetArticle coming
- Wave Solder Pallet / Thieves for Selective MaskingArticle coming
- Wave Solder Pot Temperature: SnPb 240°C, SAC 255-265°CArticle coming
- Wave Soldering Machine Components and Process FlowArticle coming
- Wave Type: Laminar Wave vs. Turbulent (Chip) WaveArticle coming
Senior Engineer· 4 of 30
- 2D X-Ray vs. 3D CT X-Ray ComparisonArticle coming
- AOI (Automated Optical Inspection) Operating PrincipleArticle coming
- AOI Camera System: 2D vs. 3D Measurement ModesArticle coming
- AOI Program Creation and False Call (Escape) MinimizationArticle coming
- AXI (Automated X-Ray Inspection) ProgrammingArticle coming
- Ball Shear Test (JESD22-B117) for BGA QualityArticle coming
- Bond Pull Test (MIL-STD-883) for Wire BondsArticle coming
- Defect Rate Tracking: DPMO (Defects Per Million Opportunities)Article coming
- Dye-and-Pry Test: BGA Crack VisualizationArticle coming
- EDX (Energy-Dispersive X-Ray) for IMC CompositionArticle coming
- Electromigration Test: High-Current Stress AnalysisArticle coming
- Flying Probe Test: Fixtureless Electrical TestingArticle coming
- Functional Test (FT): Board-Level Functionality TestRead
- ICT (In-Circuit Test): Bed-of-Nails Fixture DesignArticle coming
- IPC-A-610 Class 1, 2, 3 Requirements and DifferencesArticle coming
- IPC-A-610: Acceptability of Electronic AssembliesRead
- Ionic Contamination Test (IPC-TM-650 2.3.25)Article coming
- JTAG / Boundary Scan Test per IEEE 1149.1Article coming
- Pull Test and Shear Test: Solder Joint StrengthArticle coming
- SEM (Scanning Electron Microscopy) for Solder AnalysisArticle coming
- SIR (Surface Insulation Resistance) TestArticle coming
- SPC Control Charts for Solder Paste Process ControlArticle coming
- SPI (Solder Paste Inspection): 3D Volume MeasurementArticle coming
- SPI Alarm Criteria: Volume, Area, Height, OffsetArticle coming
- Solder Joint Acceptance Criteria: Minimum Fill PercentageArticle coming
- Solder Joint Cross-Section Analysis (Metallography)Article coming
- Solder Joint Reliability: Weibull AnalysisArticle coming
- Visual Inspection: Magnifier and Stereo MicroscopeRead
- X-Ray Inspection: BGA and QFN Void AnalysisRead
- X-Ray Void Measurement: IPC-7093 BGA Limit (25%)Article coming
Staff Engineer· 1 of 30
- CIS (Certified IPC Specialist) and CIT Certification PathArticle coming
- IEC 61191: Printed Board Assemblies — Soldering RequirementsArticle coming
- IPC-2221: Generic PCB Design StandardArticle coming
- IPC-2222: Rigid PCB Design StandardArticle coming
- IPC-2223: Flexible PCB Design StandardArticle coming
- IPC-2226: HDI (High Density Interconnect) PCB DesignArticle coming
- IPC-6012: Qualification and Performance of Rigid PCBsArticle coming
- IPC-6013: Qualification and Performance of Flexible PCBsArticle coming
- IPC-6018: Microwave End Product Board InspectionArticle coming
- IPC-7251: THT Land Pattern StandardsArticle coming
- IPC-7351: SMT Land Pattern Standards and NamingArticle coming
- IPC-7527: Reflow Profile Requirements and DocumentationArticle coming
- IPC-7711/7721: Rework, Modification, and Repair of PCBsArticle coming
- IPC-9701: Performance Test Methods for Solder Joint ReliabilityArticle coming
- IPC-9711: Practitioner's Guide for Lead-Free ReliabilityArticle coming
- IPC-A-600: Acceptability of Printed Boards (Bare PCB)Article coming
- IPC-A-610 vs. J-STD-001: Relationship and DifferencesArticle coming
- IPC-CC-830: Qualification of Conformal CoatingArticle coming
- IPC-HDBK-830: Conformal Coating Application GuideArticle coming
- IPC-J-STD-001: Requirements for Soldering Electrical AssembliesRead
- IPC-TM-650: Test Methods Manual OverviewArticle coming
- ISO 9001 Integration with IPC Quality SystemArticle coming
- J-STD-001 Class 1, 2, 3 Requirements and ApplicationArticle coming
- J-STD-001 Section 4: Materials RequirementsArticle coming
- J-STD-001 Section 5: Process RequirementsArticle coming
- J-STD-020: Moisture / Reflow Sensitivity (MSL) ClassificationArticle coming
- J-STD-033: Handling, Packing, Shipping of MSDsArticle coming
- JEDEC JESD22: Environmental Reliability Test StandardsArticle coming
- MIL-STD-2000: Standard Requirements for Soldered Electrical ConnectionsArticle coming
- MIL-STD-883: Test Methods for Microelectronic DevicesArticle coming
Distinguished Engineer· 0 of 30
- Aerospace and Military Soldering: J-STD-001 Class 3HArticle coming
- Alloy Composition Effect on Whisker SuppressionArticle coming
- Automotive Solder Reliability: AEC-Q100, AEC-Q200Article coming
- Black Pad Failure: ENIG Surface Finish Defect MechanismArticle coming
- Coating Thickness Measurement: Confocal MicroscopyArticle coming
- Conformal Coating Application: Selective, Dip, SprayArticle coming
- Conformal Coating Types: AR, SR, UR, ER, XYArticle coming
- Drop Test (JEDEC JESD22-B111): Portable Product SolderArticle coming
- Electrochemical Migration (ECM) and Dendrite FormationArticle coming
- Emerging Solder Technologies: Transient Liquid Phase BondingArticle coming
- HALT (Highly Accelerated Life Test) for Solder JointsArticle coming
- Head-in-Pillow (HiP) Defect: BGA Cold Solder ModeArticle coming
- Hybrid Assembly Risk: SAC + SnPb Mixed Alloy JointsArticle coming
- IATF 16949 Automotive Quality and Solder Process ControlArticle coming
- IMC Growth and Reliability Impact at Elevated TemperatureArticle coming
- IPC-9701 Cycle Count Prediction MethodArticle coming
- Kirkendall Voids: Cu-Sn Diffusion Void FormationArticle coming
- Lead-Free Reliability Gap: SAC305 vs. SnPb ComparisonArticle coming
- Mechanical Bending Test (IPC-9702): BGA ReliabilityArticle coming
- Medical Device Soldering: ISO 13485 Process ValidationArticle coming
- Non-Wetting and De-Wetting Failure Mode AnalysisArticle coming
- Norris-Landzberg Model for BGA Reliability PredictionArticle coming
- Process Validation Protocol: IQ, OQ, PQ DocumentationArticle coming
- Sherlock Thermal Fatigue (Coffin-Manson) AnalysisArticle coming
- Solder Pyramid Defect and Reflow Profile CorrelationArticle coming
- Solder Reliability Simulation with Ansys SherlockArticle coming
- Thermal Cycling Test (TCT): -40°C / +125°C ProfileArticle coming
- Thermal Shock Test (TST): Liquid-to-Liquid TransferArticle coming
- Tin Whisker Growth: Mechanism and Risk ManagementArticle coming
- Vibration and Shock Test: Solder Joint Fracture ModeArticle coming