Soldering
PCB assembly, solder materials, reflow/wave soldering, rework/hand soldering, quality inspection, and IPC standards.
210 topics · 0 with articles
Intern Engineer· 30
- Bare Board Incoming Inspection per IPC-A-600
- Component Lead Finish Compatibility: Sn, NiPdAu, HASL
- Component Placement Density and Thermal Management
- Component Placement Tolerances per IPC-7711
- Component Polarity Marking and Orientation Standards
- Component Polarity Verification and Error-Proofing
- Conformal Coating Basics: Types and Application Methods
- Depanelling Methods: Router, V-Scoring, Laser
- Double-Sided PCB Assembly Sequence Strategy
- ESD-Sensitive Component Handling (ANSI/ESD S20.20)
- Fiducial Mark Design and Vision Camera Reference
- First Article Inspection (FAI) for SMT Assembly
- IC Package Types: SOIC, QFP, BGA, LGA, QFN, DFN
- MSD (Moisture Sensitive Device) Bake and Open Procedure
- PCB Cleaning: No-Clean vs. Water-Soluble Flux Strategy
- PCB Impedance Control and Test Coupon Documentation
- PCB Layer Stack-Up: Signal, Power, GND Layers
- PCB Storage: Moisture Control and MSD Level Management
- Panel Design: V-Groove, Tab-Routed, Breakaway
- Pick & Place Machine Operation and Feeder Types
- SMD Package Types: 0402, 0603, 0805, 1206, 2512
- SMT (Surface Mount Technology) Basic Concepts
- SMT Line Flow Diagram: Printer → P&P → Oven → AOI
- SMT Line OEE (Overall Equipment Effectiveness) Tracking
- Silkscreen (Legend) Placement Guidelines
- Solder Mask: LPI Coating and Opening Rules
- Solder Paste Printing: Squeegee Pressure, Speed, Angle
- Stencil Design: Aperture Geometry and Reduction Ratio
- Stencil Thickness Selection: 100µm, 120µm, 150µm
- THT (Through-Hole Technology) Component Types
Junior Engineer· 30
- Alloy Selection Criteria for Reliability and Application
- Anisotropic Conductive Film (ACF) as Solder Alternative
- Bismuth-Containing Alloys and Low Melting Point Trade-offs
- Bismuth-Containing Low-Temperature Solder Alloys
- Cu3Sn and Cu6Sn5 IMC Layer Growth Kinetics
- Electromigration in Solder Joints under High Current Density
- Flux Activation Temperature and Activator Chemistry
- Flux Residue Analysis and Corrosion Risk Assessment
- Flux Types: Rosin (R, RMA, RA), No-Clean, Water-Soluble
- Gold Embrittlement: Au Content Limit in Solder Joint
- Indium-Based Alloys (InSn, InPb) for Cryogenic Applications
- Ni/Au Surface Finish IMC Formation Mechanism
- RoHS Directive and Lead-Free Transition History
- SAC305 (Sn96.5 Ag3.0 Cu0.5): Industry Standard Alloy
- SAC405 (Sn95.5 Ag4.0 Cu0.5): Higher Silver Content
- SN100C (Sn99.3 Cu0.7 Ni): Low-Cost Lead-Free Option
- Silver Sintering for Power Module Die Attach
- Solder Alloy Fundamentals: Eutectic Point and Phase Diagram
- Solder Bar: Wave Solder Pot Alloy Composition
- Solder Bath Analysis: ICP-MS and X-Ray Fluorescence
- Solder Joint Metallurgy: IMC (Intermetallic Compound) Formation
- Solder Paste Post-Print SPI (2D/3D) Volume Analysis
- Solder Paste Post-Refrigeration Warm-Up Procedure
- Solder Paste Stirring and Conditioning Protocol
- Solder Paste Storage: Refrigeration (+2/+8°C) and Shelf Life
- Solder Paste Types: Type 3 (25-45µm), Type 4, Type 5
- Solder Paste Viscosity, Slump Test, and Tack Time
- Solder Pot Contamination: Cu, Ag, Bi Buildup Analysis
- Solder Wire: Core Flux Types (Rosin, No-Clean) and Diameter
- Tin-Lead Solder (SnPb 63/37): Properties and Applications
Middle Engineer· 60
- BGA Pad Cleaning: Wick, Flux Application, and Heat
- BGA Reballing: Ball Placement Using Stencil Method
- BGA Reflow: Collapse Control and Standoff Height
- BGA Removal: Thermal Profile and Controlled Lift Mechanism
- BGA Replacement Alignment: X-Ray Verification Post-Reflow
- BGA Rework: Profile Programming and Optical Alignment
- CSP (Chip Scale Package) Rework Techniques
- Component Delta-T: Cold and Hot Spot Analysis
- Conveyor Angle and Speed Optimization
- Cooling Rate: Max 4°C/sec Rule and Microstructure Impact
- Desoldering Pump: Manual and Electric (Vacuum) Types
- Double-Pass Reflow (Double-Sided): Bottom-Side Temperature
- ESD-Safe Workstation Setup per IPC-A-610
- Flux Application for Rework: Pen, Brush, Aerosol
- Hand Soldering Basic Technique: Iron Angle and Heat Control
- Heat Transfer Efficiency: Iron-Pad-Component Contact
- Heat-Sensitive Component Protection: Heat Sink Clips
- Hot Air Station: Nozzle Selection, Temperature and Airflow
- IPC-7711/7721: Rework, Modification, and Repair Standard
- LGA Component Rework: Pad Damage Prevention
- Nitrogen (N2) Atmosphere Reflow: Benefits and Cost
- Oven Calibration Period and Thermocouple Verification
- PCB Pad Repair: Bridge Adhesive and Jumper Wire
- PCB Trace Repair: Conductive Epoxy and Copper Foil
- Post-Rework Cleaning: Isopropyl Alcohol (IPA) 99%
- Preheat Zone: Flux Activation and Moisture Removal
- Profile Measurement Equipment: KIC, ECD, Datapaq
- QFN Rework: Thermal Pad Heat Transfer Challenges
- QFP / TQFP Soldering Technique: Drag Soldering Method
- Reflow Oven Conveyor Width and PCB Handling
- Reflow Oven Zones: Preheat, Soak, Reflow, Cooling
- Reflow Peak Temperature: SAC305 Target 235-250°C
- Reflow Profile Optimization Using DOE Methodology
- Reflow Profile: Ramp Rate Limits (°C/sec) per J-STD-020
- Rework Quality Verification: Visual and X-Ray Inspection
- Rework Station Calibration and Traceability Record Keeping
- SMD Component Removal with Hot Air Station
- SOIC and SOP Component Hand Soldering Sequence
- Selective Soldering THT Component Programming
- Selective Soldering: Nozzle Types and Flux Spot Application
- Soak Zone: Thermal Equalization Across Board
- Solder Beading Defect: Stencil and Paste Design Relation
- Solder Paste Slump Test (IPC-TM-650 2.4.35)
- Solder Wick (Braid) Usage and Selection
- Solder Wire Application Technique: Heat Pad, Then Apply Wire
- Soldering Iron Selection: Wattage and Tip Type
- Surface Finish Compatibility: ENIG, OSP, HASL with Reflow
- THT Component Soldering: Solder Fill per IPC-A-610 Criteria
- Thermocouple Profile Measurement: TC Attachment on Board
- Time Above Liquidus (TAL): Typical 45-75 sec
- Tip Cleaning: Wet Sponge vs. Brass Wire Wool
- Tombstoning Defect: Root Cause and Prevention
- Vacuum Reflow Oven for Void Reduction
- Via Repair: Conductive Epoxy Fill and Capping
- Voiding in Solder Joints: Causes and IPC Acceptance Limits
- Wave Flux Application Methods: Foam, Spray, Jet
- Wave Solder Pallet / Thieves for Selective Masking
- Wave Solder Pot Temperature: SnPb 240°C, SAC 255-265°C
- Wave Soldering Machine Components and Process Flow
- Wave Type: Laminar Wave vs. Turbulent (Chip) Wave
Senior Engineer· 30
- 2D X-Ray vs. 3D CT X-Ray Comparison
- AOI (Automated Optical Inspection) Operating Principle
- AOI Camera System: 2D vs. 3D Measurement Modes
- AOI Program Creation and False Call (Escape) Minimization
- AXI (Automated X-Ray Inspection) Programming
- Ball Shear Test (JESD22-B117) for BGA Quality
- Bond Pull Test (MIL-STD-883) for Wire Bonds
- Defect Rate Tracking: DPMO (Defects Per Million Opportunities)
- Dye-and-Pry Test: BGA Crack Visualization
- EDX (Energy-Dispersive X-Ray) for IMC Composition
- Electromigration Test: High-Current Stress Analysis
- Flying Probe Test: Fixtureless Electrical Testing
- Functional Test (FT): Board-Level Functionality Test
- ICT (In-Circuit Test): Bed-of-Nails Fixture Design
- IPC-A-610 Class 1, 2, 3 Requirements and Differences
- IPC-A-610: Acceptability of Electronic Assemblies
- Ionic Contamination Test (IPC-TM-650 2.3.25)
- JTAG / Boundary Scan Test per IEEE 1149.1
- Pull Test and Shear Test: Solder Joint Strength
- SEM (Scanning Electron Microscopy) for Solder Analysis
- SIR (Surface Insulation Resistance) Test
- SPC Control Charts for Solder Paste Process Control
- SPI (Solder Paste Inspection): 3D Volume Measurement
- SPI Alarm Criteria: Volume, Area, Height, Offset
- Solder Joint Acceptance Criteria: Minimum Fill Percentage
- Solder Joint Cross-Section Analysis (Metallography)
- Solder Joint Reliability: Weibull Analysis
- Visual Inspection: Magnifier and Stereo Microscope
- X-Ray Inspection: BGA and QFN Void Analysis
- X-Ray Void Measurement: IPC-7093 BGA Limit (25%)
Staff Engineer· 30
- CIS (Certified IPC Specialist) and CIT Certification Path
- IEC 61191: Printed Board Assemblies — Soldering Requirements
- IPC-2221: Generic PCB Design Standard
- IPC-2222: Rigid PCB Design Standard
- IPC-2223: Flexible PCB Design Standard
- IPC-2226: HDI (High Density Interconnect) PCB Design
- IPC-6012: Qualification and Performance of Rigid PCBs
- IPC-6013: Qualification and Performance of Flexible PCBs
- IPC-6018: Microwave End Product Board Inspection
- IPC-7251: THT Land Pattern Standards
- IPC-7351: SMT Land Pattern Standards and Naming
- IPC-7527: Reflow Profile Requirements and Documentation
- IPC-7711/7721: Rework, Modification, and Repair of PCBs
- IPC-9701: Performance Test Methods for Solder Joint Reliability
- IPC-9711: Practitioner's Guide for Lead-Free Reliability
- IPC-A-600: Acceptability of Printed Boards (Bare PCB)
- IPC-A-610 vs. J-STD-001: Relationship and Differences
- IPC-CC-830: Qualification of Conformal Coating
- IPC-HDBK-830: Conformal Coating Application Guide
- IPC-J-STD-001: Requirements for Soldering Electrical Assemblies
- IPC-TM-650: Test Methods Manual Overview
- ISO 9001 Integration with IPC Quality System
- J-STD-001 Class 1, 2, 3 Requirements and Application
- J-STD-001 Section 4: Materials Requirements
- J-STD-001 Section 5: Process Requirements
- J-STD-020: Moisture / Reflow Sensitivity (MSL) Classification
- J-STD-033: Handling, Packing, Shipping of MSDs
- JEDEC JESD22: Environmental Reliability Test Standards
- MIL-STD-2000: Standard Requirements for Soldered Electrical Connections
- MIL-STD-883: Test Methods for Microelectronic Devices
Distinguished Engineer· 30
- Aerospace and Military Soldering: J-STD-001 Class 3H
- Alloy Composition Effect on Whisker Suppression
- Automotive Solder Reliability: AEC-Q100, AEC-Q200
- Black Pad Failure: ENIG Surface Finish Defect Mechanism
- Coating Thickness Measurement: Confocal Microscopy
- Conformal Coating Application: Selective, Dip, Spray
- Conformal Coating Types: AR, SR, UR, ER, XY
- Drop Test (JEDEC JESD22-B111): Portable Product Solder
- Electrochemical Migration (ECM) and Dendrite Formation
- Emerging Solder Technologies: Transient Liquid Phase Bonding
- HALT (Highly Accelerated Life Test) for Solder Joints
- Head-in-Pillow (HiP) Defect: BGA Cold Solder Mode
- Hybrid Assembly Risk: SAC + SnPb Mixed Alloy Joints
- IATF 16949 Automotive Quality and Solder Process Control
- IMC Growth and Reliability Impact at Elevated Temperature
- IPC-9701 Cycle Count Prediction Method
- Kirkendall Voids: Cu-Sn Diffusion Void Formation
- Lead-Free Reliability Gap: SAC305 vs. SnPb Comparison
- Mechanical Bending Test (IPC-9702): BGA Reliability
- Medical Device Soldering: ISO 13485 Process Validation
- Non-Wetting and De-Wetting Failure Mode Analysis
- Norris-Landzberg Model for BGA Reliability Prediction
- Process Validation Protocol: IQ, OQ, PQ Documentation
- Sherlock Thermal Fatigue (Coffin-Manson) Analysis
- Solder Pyramid Defect and Reflow Profile Correlation
- Solder Reliability Simulation with Ansys Sherlock
- Thermal Cycling Test (TCT): -40°C / +125°C Profile
- Thermal Shock Test (TST): Liquid-to-Liquid Transfer
- Tin Whisker Growth: Mechanism and Risk Management
- Vibration and Shock Test: Solder Joint Fracture Mode